Process for forming an electroless nickel plating seed layer on polyimide film
Introducing the latest surface treatments for flexible printed circuit boards used in smartphones, wearable devices, and more! Metallization using a wet process is possible.
Electronic devices such as smartphones are becoming smaller and more high-performance, and flexible printed circuit boards are used to meet the demands for lightweight and compact designs. Our company has newly developed a process that can form a nickel seed layer using a wet method, which is capable of responding to the miniaturization of circuits. This process is compatible with the semi-additive method, allowing for the formation of fine circuits.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
